苏菲，清华大学集成电路学院长聘教授、清华大学兴华讲席教授、博士生导师。

1999和2001年获清华大学自动化学士和硕士学位，2006年博士毕业于美国杜克大学电子与计算机工程系。2006至2025年就职于英特尔任芯片架构师；2025年加入清华大学集成电路学院。

主要研究方向包括芯片测试与可测性/可靠性设计（DFX: Design-for-Testability, Design-for-Dependability）、芯片全生命周期管理（SLM: Silicon Lifecycle Management）等。致力于从芯片电路级到架构级的创新研究，解决芯片可测性、可靠性、安全性与计算韧性（Computing Resilience）等关键难题。研究成果应用于多款具有深远行业影响力的芯片产品。技术创新获多项国际专利，涵盖3D 芯片/芯粒（Chiplet）测试、模拟芯片功能安全（Functional Safety）、智能传感器等领域。推动先进研究成果的标准化，参与多项 IEEE 国际技术标准的制定。

苏菲教授曾作为国际半导体研究协会（SRC）业界导师，指导多项产学合作研究项目，并因突出贡献荣获 2021 年 SRC Mahboob Khan Outstanding Industry Liaison Award。多次获得最佳学术论文奖，包括 IEEE 电路与系统协会 Outstanding Young Author Award、IEEE International Conference on VLSI Design Best Paper Award 等。应邀担任多个 IEEE/ACM 顶级学术会议（如 DAC、ITC、VTS、ETS）的程序委员会与组织委员会成员，并担任 IEEE Design and Test 副主编。

E-mail: sufei@mail.tsinghua.edu.cn

通信地址：北京清华大学集成电路学院

Fei Su, Professor

E-mail: sufei@mail.tsinghua.edu.cn

Prof. Fei Su is a tenured professor and the Xing-Hua Endowed Chair Professor at the School of Integrated Circuits, Tsinghua University. He received the B.E. and M.S. degrees from Tsinghua University, in 1999 and 2001, respectively, and the Ph.D. degree in electrical and computer engineering from Duke University in 2006. From 2006 to 2025, he was the integrated circuit architect at Intel Corporation. In 2025, he joined the school of Integrated Circuits, Tsinghua University.

His main research interests include integrated circuit testing, DFX (Design-for-Testability, Design-for-Dependability), SLM (Silicon Lifecycle Management). He is dedicated to advancing innovations from the circuit level to the architectural level, addressing critical challenges in silicon testability, reliability, availability and serviceability (RAS), safety, security, and computing resilience. His research has been applied to numerous chip products with significant industry impact. Technical innovations have led to multiple international patents in areas such as 3D chip/chiplet testing, analog chip functional safety, and intelligent sensors.

He has been actively involved in standardization of advanced research, having contributed to the development of several IEEE standards. He served as an industry mentor for multiple academia–industry research projects under the Semiconductor Research Corporation (SRC), and received the 2021 SRC Mahboob Khan Outstanding Industry Liaison Award. He was the recipient of multiple best paper awards, including the IEEE Circuits and Systems Society Outstanding Young Author Award and the IEEE International Conference on VLSI Design Best Paper Award. He has served on program and organizing committees of leading IEEE/ACM conferences (e.g., DAC, ITC, VTS, ETS), and as Associate Editor of IEEE Design and Test.