Yang Hu, Associate Professor

Email: hu_yang@tsinghua.edu.cn

Address: FIT Building 3-330, Tsinghua University

胡杨，清华大学集成电路学院副教授，博士生导师，高层次青年人才。从事晶圆级人工智能芯片体系架构、集成架构及编译工具链相关方向的研究，担任科技创新2030“新一代人工智能”重大项目项目负责人，获2020年NSF CAREER Award。2017年毕业于美国佛罗里达大学电子与计算机工程系，获博士学位。2017至2021年任美国德克萨斯大学达拉斯分校电子与计算机工程系助理教授。

胡杨在计算机体系结构及IC领域国际会议及期刊ISSCC、JSSC、ISCA、HPCA、ASPLOS、MICRO、DAC发表一作及通信作者文章20余篇，总共发表学术论文90余篇。学术成果共获得计算机体系结构国际顶级会议ISCA, HPCA的最佳论文提名三次，以及2015年Computer Architecture Letter期刊年度最佳论文奖。担任IEEE Transaction on Computers期刊编委，设计自动化顶级会议DAC的技术委员会主席（TPC track chair）；担任美国NSF的基金评审人。

详细论文发表情况请参考：https://dblp.org/pid/43/4685-1.html

Dr. Yang Hu is currently an Associate Professor in the School of Integrated Circuits at Tsinghua University. He receives his BS degree from Tianjin University in 2007, and his MS degree from Tsinghua University in 2011, and his Ph.D. degree from the University of Florida in 2017. He was a tenure-track assistant professor in the ECE department at University of Texas at Dallas from 2017 to 2021. Dr. Hu now works on high-performance AI chip architecture and compilation tools.

Dr. Hu is an NSF CAREER Awardee. He has published more than 50 papers in computer architecture conferences and journals such as ISCA, HPCA, ASPLOS, MICRO, SC, DAC, ICS, RTAS, ICPP, ICCD, IEEE-TCAD, IEEE-TC, and IEEE-TPDS. His research work has won Best Paper Nomination of HPCA in 2017 and 2018. He received the Best of IEEE Computer Architecture Letters Award in 2015. He is an Associate Editor of Elsevier Chip Journal. He served as TPC track chair of DAC, and TPC member of HPCA, DAC, IWQoS, ISPASS, ICPP, ICDCS, IPDPS, and etc.. He served as NSF panelists and external reviewer of Hongkong Research Grant Council. He also served as session chair of HPCA 2022 and registration chair of ICS 2018.