胡杨

 

  胡 杨 准聘副教授

 

  邮件:hu_yang@tsinghua.edu.cn

  地址:北京市清华大学FIT楼3-330

 

    Yang Hu, Associate Professor

    Email: hu_yang@tsinghua.edu.cn

    Address: FIT Building 3-330, Tsinghua University


   


 





胡杨,博士,现任清华大学集成电路学院副教授。2007年毕业于天津大学电子信息工程系,获学士学位;2011年毕业于清华大学微电子所,获硕士学位;2017年毕业于美国佛罗里达大学电子与计算机工程系,获博士学位。20172021年任美国德克萨斯大学达拉斯分校(The University of Texas at Dallas)电子与计算机工程系助理教授(Tenure-track Assistant Professor)主要从事面向新兴应用(AI5G)的异构计算加速与存算协同的研究,研究方向包括面向网络数据流的多形粒度的领域特定架构,存算协同优化的内存管理机制以及多元计算架构和内存系统的安全等方面,应用场景包括自动驾驶与边缘网络等,主持的科研项目资助金额超过100万美元。目前从事高算力人工智能芯片体系架构及编译工具链相关方向的研究。


胡杨博士曾获得2020NSF CAREER Award。在计算机体系结构及系统领域国际会议及期刊ISCAHPCAASPLOSMICRODACICSRTASICPPICCDIEEE-TCAD发表一作及通信作者文章10余篇,总共发表学术论文40余篇,其中18篇为CCF 推荐目录中计算机体系结构/并行与分布计算/存储系统领域下的A类论文,10篇为B类论文。学术成果两次获得计算机体系结构国际顶级会议HPCA的最佳论文提名(2017, 2018),以及2015Computer Architecture Letter期刊年度最佳论文奖。胡杨博士担任Elsevier Chip期刊编委,设计自动化顶级会议DAC的技术委员会主席(TPC track chair),20多个国际顶级学术会议(HPCA, DAC, IWQoS, ISPASS, ICPP, ICDCS, IPDPS)的技术评审委员(TPC);担任美国NSF以及香港Research Grant Council的基金评审人。担任HPCA 2022 session chairICS 2018 registration chair.


详细论文发表情况请参考:https://dblp.org/pid/43/4685-1.html


Dr. Yang Hu is currently an Associate Professor in the School of Integrated Circuits at Tsinghua University. He receives his BS degree from Tianjin University in 2007, and his MS degree from Tsinghua University in 2011, and his Ph.D. degree from the University of Florida in 2017. He was a tenure-track assistant professor in the ECE department at University of Texas at Dallas from 2017 to 2021. His research mainly focused on the network-oriented domain-specific architecture, co-optimization of memory/computing system for AI, and hardware security of heterogeneous system. The research projects had been funded by more than 1 million dollars. Dr. Hu now works on high-performance AI chip architecture and compilation tools.

Dr. Hu is an NSF CAREER Awardee. He has published more than 40 papers in computer architecture conferences and journals such as ISCA, HPCA, ASPLOS, MICRO, SC, DAC, ICS, RTAS, ICPP, ICCD, IEEE-TCAD, IEEE-TC, and IEEE-TPDS. His research work has won Best Paper Nomination of HPCA in 2017 and 2018. He received the Best of IEEE Computer Architecture Letters Award in 2015. He is an Associate Editor of Elsevier Chip Journal. He served as TPC track chair of DAC, and TPC member of HPCA, DAC, IWQoS, ISPASS, ICPP, ICDCS, IPDPS, and etc.. He served as NSF panelists and external reviewer of Hongkong Research Grant Council. He also served as session chair of HPCA 2022 and registration chair of ICS 2018.