蔡坚

3A1956




蔡坚 研究员


通信地址:北京清华大学集成电路学院,邮编100084

办公电话:010-62781852

E-mail:jamescai@tsinghua.edu.cn









蔡坚,1998年7月毕业于清华大学材料系,工学博士学位;1999年到2001年在香港科技大学从事博士后研究,主要从事倒装芯片封装技术的开发和研究;2001年至2002年在深圳美龙翔公司从事技术研发工作,主持开发增强型散热焊球阵列封装基板;2002年至今在清华大学微电子学研究所工作。

从事微电子封装技术与材料的研究,目前的主要研究方向为先进封装(倒装芯片、三维封装中的互连、高性能封装基板等)技术、系统级封装与异质集成、电子封装中新材料的应用、封装可靠性与失效分析等,承担过多项国家科技重大专项课题。在相关领域发表多篇高水平研究文章,参与出版译著3本,参与编写了《中国集成电路封测产业链技术创新路线图》;因在三维封装及高密度封装基板领域的研究成果获省部级奖两项。

IEEE高级会员,现担任中国电子学会电子制造与封装分会理事、国家集成电路封测产业技术创新联盟副秘书长、IEEE-EPS北京分会主席、电子元件与技术会议(IEEE-ECTC)技术委员会成员,担任过多届国际电子封装技术(ICEPT)技术委员会共同主席。

讲授《微电子封装技术》(研究生)、《集成电路封装技术》(本科生)等课程。


近年发表的部分论文:

1.Jian Cai, Junqiang Wang, Qian Wang, Experimental and computational investigation of low temperature Cu–Sn solid-state-diffusion bonding for 3D integration,Microelectronic Engineering, 236 (2021) 111479

2.Yingxia Liu, Xiuyu Shi, Haoxiang Ren,Jian Cai, Xiuchen Zhao, Chengwen Tan, K.N. Tu,Surface diffusion controlled reaction in small size microbumps,Materials Letters, 284 (2021) 129036

3.Shengjuan Zhou,Jian Cai, Qian Wang, Xiuyu Shi, Xuesong Zhang, Changming Song, A design and fabrication of transmission line for eSiFO in millimeter-wave applications, Yu Chen,2020 IEEE 70TH Electronic Components and Technology Conference (ECTC), 2020-June,2197-2202

4.Jun-Peng Fang,Jian Cai, Qian Wang, Zhi-Ting Geng, Low Temperature Au-Au Bonding Using Ag Nanoparticles as Intermediate,2020 IEEE 70TH Electronic Components and Technology Conference (ECTC), 2020-June,729-734

5.Wang, Jin; Wang, Qian; Hou, Xinnan; Du, Ke; Zhao, Lixin;Cai, Jian, Au-Rich/Sn-Bi interconnection in Chip-on-Module package,2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, 69-75

6.Liu, Ziyu;Cai, Jian; Wang, Qian; Wang, Zheyao; Liu, Lei; Zou, Guisheng, Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate,JOURNAL OF ALLOYS AND COMPOUNDS, OCT 30, 2018, 575-582

7.Liu, Ziyu;Cai, Jian; Wang, Qian; Liu, Lei; Zou, Guisheng, Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding,APPLIED SURFACE SCIENCE, JUL 1, 2018, 16-23

8.Xue, Xingjun; Zhou, Kun;Cai, Jian; Wang, Qian; Wang, Zheyao, Reactive ion etching of poly (cyclohexene carbonate) in oxygen plasma,MICROELECTRONIC ENGINEERING, MAY 5, 2018, 1-9

9.Wu, Zijian;Cai, Jian; Wang, Qian; Wang, Junqiang; Wang, Dejun, Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness,JOURNAL OF ELECTRONIC MATERIALS, OCT, 2017, 6111-6118

10.Cai, Jian; Wang, Qian; Wang, Dejun; Wang, Junqiang; Wu, Zijian, Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding,2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, 1742-1747

11.Wang, Junqiang; Wang, Qian; Wu, Zijian; Tan, Lin;Cai, Jian; Wang, Dejun, Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration,APPLIED SURFACE SCIENCE, MAY 1, 2017, 525-530

12.Wu, Zijian;Cai, Jian; Wang, Qian; Wang, Junqiang, Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD,AIP ADVANCES, MAR, 2017

13.Wang, Junqiang; Wang, Qian; Wu, Zijian; Wang, Dejun;Cai, Jian, Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration,IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, JAN, 2017, 19-26

14.Wang, Junqiang; Wang, Qian; Liu, Ziyu; Wu, Zijian;Cai, Jian; Wang, Dejun, Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection,APPLIED SURFACE SCIENCE, OCT 30, 2016, 200-206

15.Liu, Zi-Yu;Cai, Jian; Wang, Qian; Chen, Yu, Detection and formation mechanism of micro-defects in ultrafine pitch Cu-Cu direct bonding,CHINESE PHYSICS B, JAN, 2016